工业等离子体.pptx
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1、会计学1工业等离子体工业等离子体Contentsn n1 Introduction1 Introduction 1.1 The social role of industrial plasma engineering1.1 The social role of industrial plasma engineering 1.2 Important definitions 1.2 Important definitions 1.3 Plasma physics regimes and issues 1.3 Plasma physics regimes and issuesn n2 Kinetic
2、 Theory of Gases2 Kinetic Theory of Gases 2.1 measurement of high vacuum2.1 measurement of high vacuum 2.2 particle distribution functions 2.2 particle distribution functions 2.3 particle collisions 2.3 particle collisionsn n3 Motion of Charges in Electric and Magnetic Fields3 Motion of Charges in E
3、lectric and Magnetic Fields 3.1 Charged particle motion in electric fields3.1 Charged particle motion in electric fields 3.2 Charged particle motion in magnetic fields 3.2 Charged particle motion in magnetic fields 3.3 3.3 Charged Charged particle particle motion motion in in steady steady electric
4、electric and and magnetic fieldsmagnetic fields第1页/共322页n n4 Characteristics of Plasma 4.1 Bulk properties of plasma 4.1 Bulk properties of plasma 4.2 Quasi-neutrality of plasma 4.2 Quasi-neutrality of plasma 4.3 Electrostatic Boltzmann equation 4.3 Electrostatic Boltzmann equation 4.4 Simple electr
5、ostatic plasma sheaths 4.4 Simple electrostatic plasma sheaths 4.5 Plasma frequency 4.5 Plasma frequencyn n5 Electron Sources and Beams 5.1Thermionic emission sources 5.1Thermionic emission sources 5.2 Photoelectric emission sources 5.2 Photoelectric emission sources 5.3 Field emission sources 5.3 F
6、ield emission sources 5.4 Hollow cathode sources 5.4 Hollow cathode sources 5.5 Secondary electron emission sources 5.5 Secondary electron emission sources 5.6 Sources and beams characteristics 5.6 Sources and beams characteristics 5.7 Charged particle beam transport 5.7 Charged particle beam transp
7、ort第2页/共322页n n6 Ion Sources and Beams6 Ion Sources and Beamsn n7 Dark Electrical Discharges in Gases7 Dark Electrical Discharges in Gases7.1 Background ionization 7.2 Saturation regime 7.3 Townsend discharge 7.4 Corona discharges 7.5 Corona sources 7.6 Electrical breakdown第3页/共322页8 DC Electrical A
8、rc Discharges in Gases8 DC Electrical Arc Discharges in Gases 8.1 8.1 Arc regime Arc regime 8.1.1 Voltage-Current Characteristic 8.1.1 Voltage-Current Characteristic 8.2Phenomenology of electrical arcs 8.2Phenomenology of electrical arcs 8.2.1 Classical Arc Nomenclature 8.2.1 Classical Arc Nomenclat
9、ure 8.3 Physical processes in electrical 8.3 Physical processes in electrical 8.3.1 Body forces on arcs 8.3.1 Body forces on arcs 8.3.2 Electrode Jet Formation 8.3.2 Electrode Jet Formation第4页/共322页n n9 9 Inductive Inductive RF RF Electrical Electrical Discharges Discharges in in GasesGases 9.1 Intr
10、oduction 9.2 Phenomenology of RF-plasma Interactions 9.3 Skin depth of plasma 9.4 Inductive plasma torch 9.5 Other methods of generating inductive plasmas第5页/共322页Chapter 1 Introduction1.1 The social role of industrial plasma engineering1.1 The social role of industrial plasma engineering The plasma
11、 engineering have an important role to promote The plasma engineering have an important role to promote the society development and increase the living standard of the society development and increase the living standard of the human beings due to it:the human beings due to it:May May resolve the pr
12、oblemresolve the problem of the energy sourcesof the energy sources for the for the society development society development May May have very high efficiency and effectivenesshave very high efficiency and effectiveness of energy of energy consumposition consumposition May May accomplish industrial p
13、rocessingaccomplish industrial processing without unwanted without unwanted byproducts or waste materialsbyproducts or waste materials第6页/共322页Discussed in details:Discussed in details:First,First,Plasmas offer two primary characteristics of Plasmas offer two primary characteristics of industrial in
14、terest:(1)industrial interest:(1)higher temperatures and energy higher temperatures and energy densitiesdensities than that achieved by chemical or other than that achieved by chemical or other means;(2)means;(2)energetic actives speciesenergetic actives species:ultraviolet or:ultraviolet or visible
15、 photons;charged particles,including visible photons;charged particles,including electrons,ions,and free radicals;and highly electrons,ions,and free radicals;and highly reactive neutral species,such as reactive atoms reactive neutral species,such as reactive atoms(O,F,etc),excited atomic states,and
16、reactive(O,F,etc),excited atomic states,and reactive molecular fragments such as monomers.molecular fragments such as monomers.第7页/共322页and as a result,Plasmas offer benefits over other industrial processing method,such more efficiently and cheaply,without producing large volumes of unwanted byprodu
17、cts or waste materials,with minimal pollution or production of toxic wastes.第8页/共322页Some applications listed below:Some applications listed below:1.1.More efficient energy utilizationMore efficient energy utilization a)Plasma lighting devices a)Plasma lighting devices b)Plasma chemistry b)Plasma ch
18、emistry c)Materials processing with thermal plasma c)Materials processing with thermal plasma 2.2.Accomplishing unique resultsAccomplishing unique results a)Electron,ion,and plasma sources a)Electron,ion,and plasma sources b)New materials from plasma chemistry b)New materials from plasma chemistry c
19、)c)Plasma Plasma etching etching and and deposition deposition for for microelectronicsmicroelectronics d)Materials processing with thermal plasma d)Materials processing with thermal plasma e)Communications using geophysical plasmas e)Communications using geophysical plasmas f)Space propulsion syste
20、ms f)Space propulsion systems g)surface modification of materials g)surface modification of materials第9页/共322页3.3.Production with minimum waste materialsProduction with minimum waste materials a)Plasma chemistrya)Plasma chemistry b)Plasma etching and deposition for microelectronics b)Plasma etching
21、and deposition for microelectronics c)Materials processing with thermal plasma c)Materials processing with thermal plasma d)Surface treatment of materials d)Surface treatment of materials e)Ion implantation of materials e)Ion implantation of materials4.Production with minimum toxic waste4.Production
22、 with minimum toxic waste a)Plasma chemistrya)Plasma chemistry b)Plasma etching and deposition for microelectronics b)Plasma etching and deposition for microelectronics c)Surface treatment of materials c)Surface treatment of materials d)Ion implantation of materials d)Ion implantation of materials第1
23、0页/共322页1.2 Important definitions The history of plasma may be recalled to 17th century and The history of plasma may be recalled to 17th century and the termthe term plasma plasma was introduced by Irving Langmuir in was introduced by Irving Langmuir in 1928.1928.Now plasma research including three
24、 branches:Now plasma research including three branches:Plasma physicsPlasma physics:concerned with the basic laws and physic processes concerned with the basic laws and physic processes which govern the behavior of plasma.which govern the behavior of plasma.magnetohydrodynamics(MHD)magnetohydrodynam
25、ics(MHD)Electrohydrodynamics(EHD)Electrohydrodynamics(EHD)Plasma chemistryPlasma chemistry:concerned with chemical reactions which occur in concerned with chemical reactions which occur in the presence of a plasma the presence of a plasma Plasma science and plasma engineeringPlasma science and plasm
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