晶片的来料检验.ppt
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1、晶片的来料检验晶片的来料检验Chipoutsonedgeofdieshallnotpenetrateintoanyactivecircuitarea.Note:Activecircuitareaisdefinedasfromoutsideedgeofthebondpadsinward,exceptwherethereisanactivelineinthedesignlocatedbeyondtheoutsideedgeofthebondpadsCracks裂縫碎片邊緣不可 穿透線路活性的採納報廢Cracksshallnotbelongerthan1.0milinsideactivecircui
2、tareathatpointstowardoperatingmetalorfunctionalcircuitelement.裂縫不可超過限度機能線路組成Cracksthatdonotpointtowardoperatingmetalorfunctionalcircuitelementsshallnotexceed5.0milsinlength.(Silicon&GaAsDie)裂縫指向不線路活性的不可 超過限度Discolorationinglassivationouterlayerisharmlessandshallbeacceptable,providingitisnotobscuring
3、anyotherdamage.Thereshallbenocorrosioninmetallization,oranyotherlayers.Metallizationhavinganylocalizeddiscolorationshallbecloselyexaminedandshallberejected,unlessitisdemonstratedtobeaharmlessfilm,glassivationinterface,orothernon-obscuringeffects.Discoloration or Corrosion變色腐蝕狀態玻璃鈍化ThereshallbenoCond
4、uctive(opaque)ForeignMaterialonthetopofunglassivateddiethatislargeenoughtobridgetwoormoreadjacentmetallizationareas,andthatcannotberemovedContamination or Foreign material混淆外來料子不透明橋梁ContaminationorForeignmaterialThereshallbenoconductive(opaque)ForeignMaterialunderthetopglassivationlayerofthediethati
5、slargeenoughtobridgetwoormoreadjacentmetallizationareasThereshallbenoattachedorembeddedmaterialindiethatbridgestwoactivecircuitelements.GaAs:Thereshallbenoattachedorembeddedmaterialindiethatreducesspacingoftwoactivecircuitelementsbygreaterthan50percent.Silicon:Thereshallbenoattachedorembeddedmateria
6、lindiethatdoesnotprovideavisiblelineofseparationbetweentwoactivecircuitelements.附加在.深留料子Thereshallbenoliquiddrops,chemicalstains,inkorphotoresistontopofunglassivatedareasthatbridgestwoactivecircuitelements.(Liquiddrops,chemicalstains,inkorphotoresistontopofglassivatedportionofthedieareacceptable).液體
7、 水滴化學污點光致抗蝕劑GaAs(requirementonly)Thereshallbenocrackingorchippingwithinactivecircuitarea.Thereshallbenochipoutsthatextendbeyond50percentofthesubstratethicknessorcracksinsidewallsgreaterthan5.0mils.Silicon:Shallhaveavisiblelineofseparationbetweenbondpadsand/oroperatingmetallizationBridging and shorti
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