各种表面处理的无铅焊接润湿性测试PCB finish wetting balance test.ppt
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1、Wettability testing of copper based surface finishes for lead free assembly/各表面處理的無鉛焊接焊錫性測試Information provide by Atotech/資料由Atotech提供2006.3.2Training principle/培訓原則nNo advertisement/拒絕做廣告nFocus on experimental methodology and conclusions/注重于實驗方法和結論nWith the aim of learning and self-improvement/本著學習
2、和自我提升的思想nOn the basis of discussion and communication/立足于交流與討論PT manager claims/生技經理宣A few notes/几點說明nThis is a genuine piracy/本報告純屬盜版nFeel free to ask/有問題盡管問nPrepare for my questions/請准備解答我的問題nCorrect any existing mistake/糾正所有存在的錯誤nThe accuracy of the data is reserved/本人不負責數据的准确性Jeek claims/袁進 宣Con
3、tent/內容lGeneral introduction/簡介lReflow profiles/回流焊溫度曲線lWettability testing&methods/潤濕性測試與方法lDiscussion/討論lConclusion/結論Whats different in lead free soldering?/無鉛焊接到底不同在哪里?lPeak temperature is higher/最高焊接溫度更高了lTime above liquidus is longer/焊料在熔化狀態下的時間更長了lSolder composition is different/焊料的成份有變化What
4、does it mean?/無鉛焊接意味著什么?lHigher temperature/longer times/different solder alloy/更高的焊接溫度/更長的熔錫時間/焊料合金成份的變化Stronger oxidation of solder paste and surface finish/焊膏和表面處理的氧化更嚴重Thickness of IMC increased/合金層厚度更厚Metallurgy of solder joints is different/焊接點金屬特性的變化lNo long term production experience/沒有長期的量產
5、經驗Reflow equipment/回流焊設備l Reflow equipment for investigations/用于研究的回流焊設備REHM Nitro 2100l N2 atmosphere with controlled O2 concentration/氮氣保護,控制氧气含量l5 heating zones/個加熱段lConvection reflow system/對流傳熱回流焊系統Used reflow profile for subsequent aging and soldering/后續的老化實驗和焊接的溫度曲線lEutectic tin lead/錫鉛合金lSn/
6、Pb/錫鉛比 63/37/lLead free/無鉛焊料lSnAgCu/錫銀銅比307Peak最高溫度210/46s秒183oCPeak 最高溫度260/60s秒217oCAll profiles same duration of time各种溫度曲線所經歷的時間Copper based final finishes,investigated layers 研究的各种表面處理層Surface finish/表面處理Specification/規格Immersion tin/化學錫1.2um,incl.anti-whisker additive/1.2um厚,含防錫鬚添加劑Immersion s
7、ilver/化學銀0.2um,commercially available silver/organic/0.2um厚,市面上的含有机保護膜的產品HASL/熱風整平(噴錫)SnCuNi,horizontally processed/水平線OSP/有机保護膜Lead free compatible/無鉛焊接型Wettability testing/潤濕性測試lComparison of/對比性測試項目Wetting balance/潤濕平衡性測試Solder spread/錫料延伸性測試Mis-print test/絲印錯位測試De-wetting/縮錫測試lVarying/可變因素Solder
8、 flux/不同的助焊劑Solder alloys/eutectic tin-lead vs.lead-free/不同的焊料錫鉛焊料與無鉛焊料Soldering atmosphere/air vs.N2/在空气中焊接與在氮氣保護下焊接Wetting balance潤濕平衡測試/Metronelec ST60(設備名稱)lOperator independent test method/采用無人員差异性的方法lEspecially design coupon/特別設計的couponl10 coupons per surface/test每面或測測試10 個couponlThe tested sa
9、mples are fluxed before immersed into the solder pot/測試樣本在浸錫前需上助焊劑lResults are given for wetting force and wetting time/設備用于潤濕力測試和潤濕時間測試lSequence/mechanism similar to wave soldering/模擬波峰焊的步驟和机理Wetting balance-tested solder fluxes/潤濕平衡測試-測試用的助焊劑种類lUsing solder pot with SnAg3.5Cu0.7 alloy/錫爐采用SnAg3.5C
10、u0.7的合金l260oClAir atmosphere/空气中測試Tested fluxes/測試用的助焊劑种類Activity level of flux/Flux residue 助焊劑种類Presence of halide/是否含鹵素IPC-flux*acc.to J-STD-003ALow低Yes是Stannol 500-6 BModerate中等No否Litton Kester 950E3Low低No否Wetting balance test-Wetting force/潤濕平衡測試潤濕力測試lSnAg3.5Cu0.7 alloy at 260oC/air atmospherel
11、條件:空气作業,錫銀銅合金,260oClTested fluxes had minor impact to wetting forcel結論:各种助焊劑對潤濕力影響不大Initial test to determine solder flux for subsequent testing/本實驗為初步實驗,主要用于為后續試驗選取助焊劑No wetting force using the litton kester flux/使用litton kester 沒用潤濕力Wetting balance test-Wetting time/潤濕平衡測試潤濕時間測試lChoice of solderin
12、g flux strongly impacts wetting timel結論:助焊劑的選擇對潤濕時間的影響很大Initial test to determine solder flux for subsequent testing/本實驗為初步實驗,主要用于為后續試驗選取助焊劑lSnAg3.5Cu0.7 alloy at 260oC/air atmospherel條件:空气作業,錫銀銅合金,260oCNo wetting force using the litton kester flux/使用litton kester 沒用潤濕力Wetting balance test-Wetting t
13、ime/潤濕平衡測試潤濕時間測試lNitrogen atmosphere during aging/soldering improves wetting timel結論:在老化實驗和焊接時使用氮氣保護能夠改善潤濕時間After reflow ageing/reflow老化實驗后Immersion tin Tin lead vs.lead free solder alloy化學錫表面處理 錫鉛焊接與無鉛焊接的對比Wetting balance test-Wetting time/潤濕平衡測試潤濕時間測試Litton Kester 950 E3 助焊劑助焊劑lLead free using N2
14、atmosphere shows equivalent wetting time to eutecticl結論:使用氮氣保護的無鉛焊接與錫鉛焊接的潤濕時間相當Wetting balance test/潤濕平衡測試 (小結篇)lTested“moderate”activated flux showed no improvement/中等活性的助焊劑沒有改善作用lTested“halogen”containing flux only improves for OSP/助焊劑是否含鹵素只對OSP表面處理有影響lNitrogen atmosphere improved wetting time for
15、 all finishes/氮氣保護對所有表面處理的潤濕時間都有貢獻lImmersion tin showed comparable wetting time for lead free in combination with nitrogen atmosphere to eutectic tin lead/對于化學錫表面處理來說,在氮氣保護下的無鉛焊接與在空气環境中的錫鉛焊接潤濕時間相當Impact of flux,alloy and atmosphere on Metronelec test/助焊劑,焊料成份和是否有氮氣保護的影響(在Metronelec上測試)Wettability te
16、sting/潤濕性測試lSolder alloys pastes(錫膏)Tin/lead(錫鉛)Senju OZ AT-221CM-42-10(peak最高焊接溫度 210oC)/NC-SMQ 92H(peak最高焊接溫度 210oC)Lead-free(無鉛)KOKI S3X58-M406(Sn/Ag3.0/Cu0.5)(最高焊接溫度 peak 260oC)/Indium5.8 LS(Sn/Ag3.0/Cu0.5)(最高焊接溫度 peak 260oC)lAtmosphere(實驗環境)Air/空气中N2/氮氣保護Solder spread(錫料延伸性測試)/mis print(絲印錯位實驗)
17、/de-wetting(縮錫實驗)Wettability testing/潤濕性測試lSolder paste printing on a solderable surface/將錫膏印在可焊表面lThe spread of liquefied and solidified solder is measure/量測熔化擴張凝固后的焊料尺寸lSolder spreads in all directions(360o)only on the pad surface(2 dimensional)/焊料在pad表面二維的向各個方向擴張lSequence/mechanism similar to sta
18、ndard SMT reflow soldering/程序机理模擬標准的SMT回流焊Solder spread(錫料延伸性測試)40 solder dots per surface/test 每表面/測試40個焊點lOnly the bulk soldered diameter was measured,not the solder spikes/量測時只量測大塊的熔錫而不算單點的錫突點Wettability testing/潤濕性測試Solder spread(錫料延伸性測試)Immersion tin/化學錫Immersion silver/化學銀OSP/有机保護膜Wettability
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